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Programme Overview
Qualification
BEng (Hons)
Provider
SIT & University of Glasgow
Duration
3 years
Total credits
180
Application period
8 January to 19 March 2025
Next intake
Campus location
SIT@NP Building (SIT Punggol Campus from May 2025)
The SIT and University of Glasgow joint degree in Mechanical Engineering is a three-year honours program that offers a comprehensive foundation in mechanical engineering along with essential digital skill sets. This program allows you to specialise in one of three exciting fields: Design, Mechatronics, or Aerospace.
- Under the Design specialisation, students will learn the concepts of digital manufacturing and design through modules in additive engineering, engineering materials technology, mechanical design and microelectronics for engineering products.
- Students in the Mechatronics specialisation will learn the special skill sets in IIoT, that apply to automation and robotics, mechatronics design, co-bot design and build, as well as machine learning.
- The Aerospace specialisation offers comprehensive insights into aircraft performance, propulsion, and computational aerodynamics. Through modules like UAV Project and Guidance, Navigation, and Control, students gain hands-on experience and expertise in unmanned aerial vehicles and aerospace technologies.
To thrive in today's industrial landscape, it is crucial to possess the knowledge, understanding, and skills required for mechanical engineering. Through project-based multidisciplinary learning and direct industrial immersion, you will not only gain a deep understanding of Industrial Internet of Things (IIoT), data analytics, and digital designs but also acquire advanced knowledge in these areas.
Our degree program is designed to prepare graduates for the increasing demands of various key industries in Singapore. These industries include aerospace engineering, healthcare engineering, automation/robotics, smart designs utilizing 3D printing, and digital design tools for manufacturing and maritime sectors. By pursuing this joint degree program, you will develop a strong foundation in mechanical engineering while also gaining expertise in emerging digital technologies. This unique combination of skills will enable you to excel in the ever-evolving landscape of the engineering industry and make a significant impact in your chosen field.
Graduates from this programme will be equipped with sound principles in mechanical design or mechatronics as well as deep knowledge in digitalisation. They will be practice-oriented and innovative individuals with the right skill sets for the future digital economy.
Curriculum Highlights
-
Smart Designs
-
Industrial Internet of Things (IIoT)
-
Healthcare Systems Engineering
-
Automation and Robotics
-
Co-bot Design and Build
-
UAV Design
Integrated Work Study Programme
Integrated Work Study Programme provides students with the opportunity to undertake real work. Held over the span of eight months, it is designed to be more in-depth than a traditional internship. You will gain real work experience and apply the theories you learn in class with actual practice.
Overseas Immersion Programme
Students will participate in an intensive three-week Overseas Immersion Programme at the home campus of the University of Glasgow where they get to experience life as a student in Glasgow, United Kingdom. The programme itinerary includes library and career talks, academic lectures, research and literature review workshops to prepare students for their final-year dissertation projects, as well as visits to companies, museums and key cultural sites.
Career Options
- R&D Engineer
- Development Engineer
- Automation Engineer (CAD/ Automation/AI)
- Project Engineer
- Software Engineer
- Mechatronics Engineer
- Mechanical Design Engineer
- Drone Systems Engineer
- Aerodynamics Engineer
- Flight Simulation/Testing Engineer
- Air Traffic Controller
Programme Structure (AY2025/26)*
- Core Modules
(117 Credits) - Specialisation Modules
(30 Credits) - Unrestricted Electives
(18 Credits) - University Modules
(15 Credits)
| Module Title | Credits |
|---|---|
| Engineering Mathematics 1 | 6 |
| Programming | 6 |
| Electrical Circuits and Analysis | 6 |
| Engineering Mathematics 2 | 6 |
| Dynamics | 6 |
| Sensors and Electronic System | 6 |
| Engineering Graphics | 6 |
| Engineering Mechanics | 6 |
| Engineering Materials | 6 |
| Control | 6 |
| Mechanics of Solids | 6 |
| Thermodynamics and Heat Transfer | 6 |
| Fluid Dynamics | 6 |
| Mechanical Simulation | 3 |
| Risk and Reliability Analysis | 6 |
| Integrated Work Study Programme | 20 |
| Capstone Project | 10 |
| Students are required to choose 3 out of the 7 elective modules. | |
* The programme structure is subject to change without prior notice. SIT regularly reviews its curriculum to ensure that it remains industry-relevant and prepares our students for the evolving needs of industry.
Eligibility and Exemption
Diploma holders from any of the five local polytechnics, A level / IB Diploma graduates, and holders of equivalent Year 12 qualifications are welcome to apply.
Subject to approval, diploma applicants may be granted module exemptions, based on the modules taken during their diploma.
A-Level / IB Diploma Prerequisites
Obtained a good pass in one H1/H2 or SL/HL Mathematics and also a good pass in one H1/H2 or SL/HL Physics.
Fees and Finances
Singapore Citizen
Subsidised fees per credit
$173.00
Total credit
180
Tuition fees: $31,140.00 for SG Citizens / $116,739.00 Non-subsidised fees.
Permanent Resident
Subsidised fees per credit
$336.66
Total credit
180
Tuition fees: $60,600.00 for Permanent Resident / $116,739.00 Non-subsidised fees.
International Student
Subsidised fees per credit
$463.25
Total credit
180
Tuition fees: $83,385.00 for International Student / $116,739.00 Non-subsidised fees.
Industry Advisory Committee
The members of the Industry Advisory Committee for this programme are:
Mr Ang Wee Seng (Chairman)
Executive Director
Singapore Semiconductor Industries Association (SSIA)
Mr Lalit Bangera
Digitalisation Consultant
Siemens Pte Ltd
Mr Deon Siah
Chief of Staff & Head of Finance
Arcstone Pte Ltd
Mr Samuel Lee
Chief Technical Officer
Hope Technik Pte Ltd
Mr Lee Shien Yang
Deputy Director, Stage Business Unit
Akribis Systems Pte Ltd
Mr David So Man Fung
Senior Vice President, Corporate Planning & Continuous Improvement
SIA Engineering Company
Mr Derek Cheng
Head of Commercial APAC
Vertical Aerospace
Mr Peter Tan Boon Heng
Co-Chairman
Advanced Remanufacturing and Technology Centre (ARTC), A*STAR
Ms Enci Mary Kan
Director, MedTech
A*STAR (I&E-BMRC-SERC)
