Bond Capital Bursary

The Bond Capital Bursary was established to support financially disadvantaged and deserving undergraduates pursuing a full-time undergraduate degree at the Singapore Institute of Technology (SIT).

About the Donor

This Bursary is made possible by a gift from Mr Lim Sze Wee.

How To Apply

Applications for Public Bursaries, Donated Bursaries & Scholarships will commence in July 2022. Do keep a look out for more information which will be sent to your SIT e-mail address.

Matriculated students are to submit their Financial Aid application via the SIT Student Intranet - IN4SIT. Do note that students are to connect to the SIT VPN before accessing IN4SIT. 

Applicants will need to complete and submit the online application form and upload all required supporting documents through the application portal by the given deadline.

 
Download System User Guide
Financial Aid Application
 
 
Download Supporting Documents Guide
Financial Aid Application Procedure
 
 
Download VPN Setup guide
Global Protect (VPN) Guide for Student
 
 
Download FAS Brochure
Scholarships & Financial Assistance
 

Please refer to the Frequently Asked Questions for more information.