
Shen Lu
Profile
Appointment(s) in Professional Officers Division
- Capability Development Lead (Testing and Inspection)
- Co-Chair (POD Applied Research Committee)
- Deputy Head, Rapid Product Innovation and Development (RaPID)
Lab-In-Charge
Lab Name | Building | Location |
---|---|---|
Applied Research Industry Lab | SIT@Dover Uni Resource Centre | DV-URC-SR4A |
Physics Lab | DV-AP-SR2D/2E | SIT@Dover Acad Plaza |
Educational Background
- PhD in Material Science and Engineering
Technical Skill Set
- Materials Characterisation
- Microstructure Analysis (Scanning Electron Microscopy; Atomic Force Microscopy)
- Mechanical Testing (Nanoindentation; Creep Test, Viscoelastic Analysis; UTM)
Project Involvement in SIT
- Design and Development of Wastewater Autosampler– Present
PI
- Integrated Rehabilitation Parallel Bars and Staircases–
Co-PI
- Electrokinetic Flow in Normal Dental Enamel–
Modules
-
SIE2007 - Land Transport Discovery Course
-
PHY200L - Motion Dynamics Lab
-
PHY200 - Motion Dynamics
-
SEM 2201 - Motion Dynamics
-
ASE1102 - Physics: Motion Dynamics
-
PHY250 - Waves, Optics, and Thermodynamics
-
SEM 2202 - Waves, Optics and Thermodynamics
-
FTE1021 - Engineering Fundamentals (Mechanics and Electricity)
-
CVE3171 - Integrated Work Study Programme (IWSP)
-
ASE2306 - Capstone Project
Publications
Journal Papers
Lu Shen, Frederico Barbosa de Sousa, NamBeng Tay, Teo Siew Lang, Vivian Lin Kaixin, Jongyoon Han, LaTonya Kilpatrick-Liverman, Wei Wang, Stacey Lavender, Shira Pilch, Hiong Yap Gan. “Deformation behavior of normal human enamel: A study by nanoindentation”. Journal of the Mechanical Behavior of Biomedical Materials. Volume 108 (2020) Page 103799.
Lu Shen, A.Q.L. Foo, S.J. Wang, Z. Chen. ‘Enhancing creep resistance of SnBi solder alloy with non-reactive nano fillers: A study using nanoindentation’. Journal of Alloy and Compounds. 2017;729:498-506.
Lu Shen, Y.Y. Wu, S.J. Wang, Z. Chen. ‘Creep behaviour of Sn-Bi solder alloys at elevated temperatures studied by nanoindentation’. Journal of Materials Science: Materials in Electronics. 2017:28(5):4114-4124.
Lu Shen, P. Lu, S.J. Wang, Z. Chen. ‘Creep behavior of eutectic SnBi alloy and its constituent phases using nanoindentation technique’. Journal of Alloys and Compounds. 2013;574:98-103.
Lu Shen, Z.Y. Tan, Z. Chen. ‘Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers’. Materials Science & Engineering A. 2013;561:232–238.
Lu Shen, W.C.D. Cheong, Y.L. Foo, Z. Chen. ‘Nanoindentation creep of tin and aluminium: A comparative study between constant load and constant strain rate methods’. Materials Science and Engineering A. 2012:532:505– 510.
Lu Shen, P. Septiwerdani, Z. Chen. ‘Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation’. Materials Science & Engineering A. 2012;558:253–258.
Lu Shen, I.Y. Phang, T.X. Liu. ‘Nanoindentation studies on polymorphism of nylon 6’. Polymer Testing. 2006;25(2):249-253
Lu Shen, L. Wang, T.X. Liu, C.B. He. ‘Nanoindentation and morphological studies of epoxy nanocomposites’. Macromolecular Materials and Engineering. 2006;291:1358-1366.
Lu Shen, T.X. Liu, P.F. Lv, ‘Polishing effect on nanoindentation behaviour of nylon 66 and its nanocomposites’. Polymer Testing. 2005;24:746-749.
Lu Shen, W.W.C. Tjiu, T.X. Liu. ‘Nanoindentation and morphological studies on injection-molded nylon-6 nanocomposites’. Polymer. 2005;46:11969-11977.
Lu Shen, I.Y. Phang, L. Chen, T.X. Liu, K.Y. Zeng. ‘Nanoindentation and morphological studies on nylon 66 nanocomposites. I. Effect of clay loading’. Polymer. 2004;45(10):3341-3349.
Lu Shen, K.Y. Zeng. ‘Comparison of mechanical properties of porous and non-porous low-k dielectric films’. Microelectronic Engineering 2004;71:221-228.
Lu Shen, I.Y. Phang, T.X. Liu, K.Y. Zeng. ‘Nanoindentation and morphological studies on nylon 66/organoclay nanocomposites. II. Effect of strain rate’. Polymer. 2004;45(24):8221-8229.
Lu Shen, K.Y. Zeng, Y.H. Wang, B. Narayanan, R. Kumar, 'Determination of the hardness and elastic modulus of low-k thin films and their barrier layer for microelectronic applications'. Microelectronic Engineering. 2003;70(1):115-124.
Conferences
Lu Shen, Pradita Septiwerdani, Zhong Chen. ‘Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation’. Thin Films 2012, oral presentation, Singapore. July 14-16 2012.
Lu Shen, ZY Tan, Z. Chen. ‘Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers’. Thin Films 2012, oral presentation, Singapore. July 14-16 2012.
V. N. Sekhar, Lu Shen, Aditya Kumar, T. C. Chai, Lee Wen Sheng Vincent, Wang Xin Lin Sandy, Zhang XW, C. S. Premchandran. ‘Effect of Wafer Back Grinding on the Mechanical Behavior of Multilayered low k for 3D stack packaging applications’. ECTC 2008, June 2008, USA.
Lu Shen, Tianxi Liu. ‘Nanoindentation and morphological studies on nylon 66 nanocomposites: Effect of Clay Loading’. ICYS-ICMR Summer School on Nanomaterials 2007, from July 23 to July 28, Tsukuba, Japan.
Lu Shen, Kaiyang Zeng. ‘Mechanical Characterization on Porous Low K Films’. International Conference of Materials for Advanced Technologies, Dec 7-12, 2003, Singapore.
Y. F. Chow, T. H. Foo, Lu Shen, J. S. Pan, A. Y. Du, Z. X. Xing, Y. J. Yuan, C. Y. Li, R. Kumar, P. D. Foo. ‘A correlation study of thermal stability on porous low k’. MRS Spring 2002, Vol 716, Symposium B (B12.2).