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With Chun Piaw, Rayner Ng

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Principal Professional Officer

Chun Piaw, Rayner
Ng

Head, Design Factory@SIT
Master of Business Administration, California State University (Sacramento), United States
Email

SIT Appointments

  • Head, Design Factory@SIT
    – Present

Education

  • Master of Business Administration
    California State University (Sacramento) , United States
  • Master of Science (Biomedical Engineering)
    Nanyang Technological University , Singapore
  • Master of Technological Design (Rapid Product Development)
    National University of Singapore and Eindhoven University of Technology , Singapore
  • Bachelor of Engineering (Electronics Engineering)
    The University of Sheffield , United Kingdom

Achievements

  • Inaugural Design Power Index award by the Design Business Chamber Singapore
    –
  • Firefly Award Innovative Project Policy by Ministry of Trade and Industry - Innovation Factory
    –

Professional Certification

  • AI for Business Transformation: Generative AI and Beyond
    Imperial College London
    –
  • Sustainability Strategies and Green Economy Programmw
    SMU-ExD Executive Development
    –
  • Product-Technology Roadmapping
    University of Cambridge
    –
  • FDA Quality System Regulation
    AAMI
    –

Awards

  • 2025 Inaugural Design Power Index award by the Design Business Chamber Singapore
  • 2023 Firefly Award Innovative Project Policy by Ministry of Trade and Industry - Innovation Factory

Industry Experience

  • A*STAR SIMTech Innovation Factory
    –
  • Venture Corporation Limited
    –
  • A*STAR National Robotics Programme (NRP)
    –
  • Sirona Dental Systems
    –
  • Hill-Rom
    –
  • Welch Allyn
    –
  • Addvalue Technologies
    –
  • SANYO Telecommunications
    –
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Technical Skills

  • Electrical/electronic design (ECG, patient monitors, embedded systems)
  • Electro-mechanical systems design
  • PCB/circuit design tools: Mentor Graphics DxDesigner, PADS, Cadence OrCAD, PSpice
  • Baseband architecture (CDMA, WCDMA, UMTS, 3GPP)
  • Embedded systems (Renesas 32-bit, WinCE OS)
  • Connectivity protocols: GSM/GPRS, GPS, USB, RS232, Ethernet, IrDA
  • Robotics systems (ROS development, navigation, sensors)
  • Industrial IoT (IIoT)
  • Automation solutions for smart factory
  • Human-robot interaction
  • ISO 13485, ISO 14971, IEC 62304, IEC 62366, IEC 60601
  • 21 CFR 820 (QSR/GMP)
  • FMEA, DFSS, risk management
  • Design Thinking
  • Value Steam Mapping
  • Prototyping
  • Programme Management
  • Technology Risk Management
  • Patient support systems (bed systems, lifts, respiratory)
  • Diagnostic devices (ECG, patient monitors, SpO2, defibrillators)
  • Dental engineering and treatment systems
  • Biomedical engineering

Research Interests

  • AI & Data

    • AI applications in robotics and manufacturing

    • Data-driven decision making

    • Dashboard design and operational analytics

       

  • Startup & Ecosystem Development
    • MedTech startup mentorship
    • Robotics and tech ecosystem building
    • SME and startup commercialisation pathways

     

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IP / Patents

  • Lift System with Status Indicator and Interpretive Indicator US US20160296399A1 · Pub. Date Oct 13, 2016 https://patentimages.storage.googleapis.com/2e/2c/5a/9c730767ec5a6c/US20160296399A1.pdf
  • Lift system with status indicators US US9463128 · Pub. Date May 1, 2014 https://patentimages.storage.googleapis.com/69/c7/36/5eafc8225bc3dd/US20140115778A1.pdf
  • High Frequency Chest Wall Oscillation (HFCWO) Data Connectivity Systems and MethodsHigh Frequency Chest Wall Oscillation (HFCWO) Data Connectivity Systems and Methods US US61773856P0, US20140257151A1 · Pub. Date Sep 11, 2014 https://patentimages.storage.g
  • Lift system with status indicators | Aufzugsystem mit Statusanzeigern | Système de levage avec des indicateurs d'étatLift system with status indicators | Aufzugsystem mit Statusanzeigern | Système de levage avec des indicateurs d'état EU EP2727571A3. Pub.
  • Key Vital Signs Monitoring Bedding SystemKey Vital Signs Monitoring Bedding System US US 61/761,955 · Issued Feb 7, 2013 https://patentimages.storage.googleapis.com/1f/cd/81/c93af38bcd8cbd/US20140257151A1.pdf
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