Get in Touch

With Desmond CHONG

Name and email
CAPTCHA This question is for testing whether or not you are a human visitor and to prevent automated spam submissions.
Associate Professor

Desmond CHONG

Associate Professor
Doctor of Philosophy (Mechanical Engineering / Biomechanics), Imperial College London, United Kingdom
Cluster:
Engineering
Email

SIT Appointments

  • Associate Professor
    – Present
  • Deputy Programme Director - SIT-UofG BEng (Hons) Aerospace Engineering
    –
  • Deputy Programme Director - UofG BEng (Hons) Aerospace Systems
    –
  • Deputy Programme Director - UofG BEng (Hons) in Aeronautical Engineering
    –
  • Assistant Professor
    –

Education

  • Doctor of Philosophy (Mechanical Engineering / Biomechanics)
    Imperial College London , United Kingdom
  • Master of Engineering in Mechanical Engineering
    Nanyang Technological University , Singapore
  • Bachelor of Engineering in Mechanical Engineering
    Nanyang Technological University , Singapore

Achievements

  • Award from Students: Gold Award, 11th Scientific Meeting of Biomedical Engineering Society (Singapore) – BES-SEC (Society of Engineers for the Community) Students’ Design Award, 2017
  • Award from Students: • Gold Award for poster presentation, 11th Scientific Meeting of Biomedical Engineering Society (Singapore), undergraduate category, 2017
  • Award from Students: Bronze Award for Design category, iCreate 2017 Global Student Innovation Challenge for Assistive Technology (gSIC-AT), Kobe, Japan, 2017
  • Best Poster Award – First Prize, 2nd Asian Materials Education Symposium, Singapore
  • Innovative Teaching Award, Faculty of Engineering, NUS
  • Media coverage on The Straits Times pB8, “Solving problems from ground up – Pilot programme trains NUS High School students to find answers to real-life challenges”, 3rd May 2012
  • Media coverage on Lianhe Zaobao p23 (联合早报), “NUS engineering students to design rehabilitation equipment to benefit patients” (工程系学生医院上课将设计复健器材造福病人), 24th Nov 2012
  • Medical Research Scientist Award, National Medical Research Council, Ministry of Health, Singapore
  • Postgraduate Training Initiative Scholarship, National Science and Technology Board, Singapore

Professional Memberships

  • International Representative, ASME Group Engagement Committee, 2017 to 2019
    – Present
  • ASME Singapore Section Executive Committee – Chair (2017/18, 2011/12), Chair-Elect (2016/17, 2010/11), Honorary Secretary (2009/10), Honorary Treasurer (2015/16, 2004/05), Special Projects (2005/06), Young Engineers Chair (2003/04), Member (2002-current
    – Present
  • Member, American Society of Mechanical Engineers (ASME)
    – Present
  • District Leader, ASME District G (Asia Pacific region)
    –

Corporate Experience

  • Senior Lecturer, National University of Singapore
    –
  • Industry Development Manager, Institute of Materials Research & Engineering (IMRE), A*STAR
    –
  • R&D Manager, United Test & Assembly Center (UTAC)
    –
  • R&D Engineer, Motorola Electronics Singapore
    –

Research Interests

  • Expertise in Mechanics (solid mechanics, biomechanics and computational mechanics) and Design
  • Research strengths and interests
    • Computational simulation and finite element analysis
    • Experimentation and data acquisition
    • Engineering / Medical devices design
    • User-centric product design
    • Orthopaedic implant design
    • Rehabilitation engineering
    • Gait and human motion analyses (3D motion capture and EMG)

Past Projects

  • PI: “Reliability analysis and inspection of the train coupler and brackets”
    –

    Land Transport Authority and SBS Transit

  • Co-PI: “Hand hygiene reminder and monitoring system”
    –

    SIT Ignition and Innovation Grant

  • PI: “Finite element analysis of bone and implant stresses in the use of 3D printed orthopaedic implants”
    –

    National University Hospital

  • PI: “Design of a portable universal muscle strengthening and rehabilitation device for the elderly and post-stroke patients”
    –

    SIT Community Innovation Fund

  • PI: “A measure on the use of quiz-based learning environment in enhancing student learning in engineering modules”
    –

    SIT Advancement of Learning and Teaching (SALT) Grant

  • Co-PI: “Arm skate rehab device for post-stroke exercise”
    –

    SIT Ignition Grant

  • Co-PI: “Design and development of an interpositional knee spacer for knee osteoarthritis”
    –

    SingHealth Foundation Research Grant

  • Co-PI: “Risk of periprosthetic tibial fracture after unicompartmental knee replacement: A biomechanical study for the Asian population”
    –

    NUHS Clinician Scientist Program

  • PI: “Design innovation in next-generation joint implants for more active and younger patients”
    –

    Academic Research Fund (AcRF) Tier 1, Ministry of Education (MOE), Singapore

  • Co-PI: “Harvesting corticocancellous bone graft from the proximal tibia as an alternative to the iliac crest – a biomechanical and computational study”
    –

    National Medical Research Council (NMRC) Grant

Journal Papers

  • FC Han, CJ Pearce, DQK Ng, AK Ramruttun, DYR Chong, D Murphy, CT Lim, BCS Lee, “A double button adjustable loop device is biomechanically equivalent to tension band wire in the fixation of transverse patellar fractures—A cadaveric study”, Injury, No. 2, pp 270-276, 2017. (DOI: http://dx.doi.org/10.1016/j.injury.2016.11.013)

  • DYR Chong, UN Hansen, AA Amis, “Cementless MIS Mini-Keel Prosthesis Reduces Interface Micromotion versus Standard Stemmed Tibial Components”, Journal of Mechanics in Medicine and Biology, Vol.16, No. 5, 1650070, 2016. (DOI: 10.1142/S0219519416500706)

  • CT Lim, DQK Ng, KJ Tan, AK Ramruttun, W Wang, DYR Chong, “A Biomechanical Study of Proximal Tibia Bone Grafting Through the Lateral Approach”, Injury, Vol. 47, No. 11, pp 2407–2414, 2016. (DOI: http://dx.doi.org/10.1016/j.injury.2016.09.017)

  • T Prachgosin, DYR Chong, W Leelasamran, P Smithmaitrie, S Chatpun, “Medial Longitudinal Arch Biomechanics Evaluation During Gait in Subjects with Flexible Flatfoot”, Acta of Bioengineering and Biomechanics, 2015, Vol. 17, No. 4, pp 121-130, 2015. (DOI: 10.5277/ABB-00296-2015-02)

  • DYR Chong, UN Hansen, R van der Venne, N Verdonschot, AA Amis, “The Influence of Tibial Component Fixation Techniques on Resorption of Supporting Bone Stock after Total Knee Replacement”, Journal of Biomechanics, Vol. 44, No. 5, pp 948–954, 2011.

  • DYR Chong, UN Hansen, AA Amis, “The Influence of Tibial Prosthesis Design Features on Stresses Related to Aseptic Loosening and Stress-Shielding”, Journal of Mechanics in Medicine and Biology, Vol. 11, No. 1, pp 55–72, 2011.

  • DYR Chong, UN Hansen, AA Amis, “Analysis of Bone-Prosthesis Interface Micromotion for Cementless Tibial Prosthesis Fixation and the Influence of Loading Conditions”, Journal of Biomechanics, Vol. 43, No. 6, pp 1074-1080, 2010.

  • DYR Chong, FX Che, LH Xu, HJ Toh, John HL Pang, BS Xiong, BK Lim, “Evaluation on Influencing Factors of Board-level Drop Reliability for Chip Scale Packages (Fine-pitch Ball Grid Array)”, IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp 66-75, February 2008.

  • DYR Chong, FX Che, JHL Pang , K Ng, JYN Tan, PTH Low, “Drop Impact Reliability Testing for Lead-Free and Lead-Based Soldered IC Packages”, Microelectronics Reliability, Vol. 46, Issue 7, pp. 1160-1171, July 2006. (ranked number 1 for TOP25 Hottest Articles in Microelectronics Reliability, Jul-Sep 06)

  • DYR Chong, BK Lim, Kenneth J Rebibis, SJ Pan, Krishnamoorthi S, R Kapoor, Anthony YS Sun, HB Tan, “Exposed Die-Top Encapsulation Molding for an Improved High Performance Flip Chip BGA Package”, IEEE Transactions on Advanced Packaging, Vol.29, No. 4, pp 674-682, November 2006.

  • John HL Pang, DYR Chong, TH Low, “Thermal Cycling Analysis of Flip Chip Solder Joints”, IEEE Transactions on Component & Packaging Technologies, Vol. 24, No. 4, pp 705-712, December 2001.

  • John HL Pang, DYR Chong, “Flip Chip on Board Solder Joints Reliability Analysis Using 2-D and 3-D FEA Models”, IEEE Transactions on Advanced Packaging, Vol. 24, No. 4, pp 499-506, November 2001.

Conferences

  • FC Han, CT Lim, D Murphy, CJ Pearce, BCS Lee, AK Ramruttun, DQK Ng, DYR Chong, “A double button adjustable loop device is biomechanically equivalent to tension band wire in the fixation of transverse patellar fractures – A cadaveric study”, 18th EFORT Congress, Vienna, Austria, 31 May – 2 Jun 2017

  • YY Pang, ZR Kong, DYR Chong, “Universal muscle strengthening and rehabilitation device for the elderly and post-stroke patients”, 11th International Convention on Rehabilitation Engineering and Assistive Technology, Kobe, Japan, 22-24 Aug 2017.

    (Bronze Award for Design category at Global Student Innovation Challenge for Assistive Technology)

  • AMB Abdullah, DYR Chong, “Development of a wearable device to measure posture deviations and posture rehabilitation in people with Parkinson’s Disease”, Biomedical Engineering Society (Singapore) 11th Scientific Meeting, 20 May 2017.

    (awarded Best Undergraduate Poster Presentation – Gold Award)

  • AMB Abdullah, DYR Chong, “Development of a wearable device to measure posture deviations and posture rehabilitation in Parkinson’s disease patients”, 11th International Convention on Rehabilitation Engineering and Assistive Technology, Kobe, Japan, 22-24 Aug 2017

  • YY Pang, ZR Kong, DYR Chong, “Design of a low-cost and portable universal muscle strengthening and rehabilitation device for the elderly and post-stroke patients”, Biomedical Engineering Society (Singapore) 11th Scientific Meeting, 20 May 2017.

    (awarded BES-SEC Students’ Design Competition – Gold Award)

  • XL Wu, JYM Choi, RCH Yeow, DYR Chong, “The Study of the Effect of Hip Abductor Strengthening Exercises on Biomechanics of Subjects with Patellofemoral Pain Syndrome”, 16th International Conference on Biomedical Engineering, Singapore, 7-10 December 2016

  • CT Lim, D Ng, FC Han, W Wang, KJ Tan, AK Ramruttun, DYR Chong, “Fatigue Strength of the Proximal Tibia Donor Site after Extensive Bone Grafting”, Annual Meeting of the American Academy of Orthopaedic Surgeons, Orlando, USA, 1-5 March 2016.

  • ASM Goh, JH Choo, DYR Chong, “The Scooter as a Vehicle to Teach Materials”, 2nd Asian Materials Education Symposium, Singapore, 8-9 December 2016

  • CK Chan, JC Teoh, LC Hernandez-Barraza, DYR Chong, CH Yeow, “Effects of Additional Constant and Impromptu Cognitive Loadings on Lower Extremity Gait Performance”, 25th Congress of the International Society of Biomechanics, Glasgow, UK, 12-16 July 2015.

  • HL Koh, ZY Li, AHK Chan, EL Tay, DYR Chong, “A Study on the Kinematics of Human Subjects in Using A New Backward Fall Compensatory Response Training Device”, Biomedical Engineering Society (Singapore) 9th Scientific Meeting, 16 May 2015. (awarded First Runner-up (Merit) for poster presentation, undergraduate category)

  • K Junitra, NA Azman, SZ Sarker, FM Lim, PY Lee, DYR Chong, “Development of a Plantar Pressure Measuring Device for Gait Correction for Diabetic Patients with Neuropathy”, Singapore Rehabilitation Conference 2015, 26-27 March 2015.

  • ACT Choh, JCK Ng, AKS Yew, SL Chia, DYR Chong, “The Study of Contact Pressure of a Customized Knee Spacer Using Finite Element Analysis”, 7th WACBE World Congress on Bioengineering, IFMBE Proceedings Vol. 52. Singapore, 6-8 July 2015.

  • CT Lim, DQK Ng, W Wang, KJ Tan, DYR Chong, “Optimizing Bone Grafting Procedures in Proximal Tibial Bone Grafting - A Biomechanical Study”, 61st Annual Meeting of the Orthopaedic Research Society, Las Vegas, USA, 28-31 March 2015.

  • C Wong, GL Foo, JH Choo, DYR Chong, “Pre-surgical Planning of Bone Fracture Fixation Using 3D Printing Technology”, 16th EFORT Congress (European Federation of National Associations of Orthopaedics and Traumatology), Prague, Czech Republic, 27-29 May 2015.

  • DQK Ng, CT Lim, W Wang, KJ Tan, DYR Chong, “A Validated FE Model for Proximal Tibia Bone Grafting: The Study of the Effect of Window Size on Tibia Stability and Mechanics”, 61st Annual Meeting of the Orthopaedic Research Society, Las Vegas, USA, 28-31 March 2015.

  • DYR Chong, SJ Yeo NO Nivbrant, B Nivbrant, NN Lo, “Is Fixation Performance of MIS Mini-keel Tibial Prosthesis Comparable to Standard Stemmed Prosthesis – A Randomised Clinical Study with RSA”, 59th Annual Meeting of the Orthopaedic Research Society, San Antonio, USA, 26-29 January 2013.

  • EK Soh, A Kaur, MP Tham, DYR Chong, “Engineers in Hospital: An Immersive and Multidisciplinary Pedagogical Approach for Better Solutions”, Proceedings of the 120th ASEE Annual Conference and Exposition, Atlanta, USA, 23-26 June 2013, P8128.

  • EX Ng, C Monkhouse, P Wong, G Meyer, Y Aloni, DYR Chong, “Assessment of the Impact of Positive Heels (Plantarflexion) and Negative Heels (Dorsiflexion) Shoes on Human Walking Gait”, The 15th International Conference on Biomedical Engineering, IFMBE Proceedings Vol. 43, Singapore, 4-7 December 2013.

  • DYR Chong, JH Choo, EK Soh, YS Ng, MP Tham, “An Engineering in Medicine Programme - Opening Engineering Students’ Mind Through a Living Laboratory Education”, Proceedings of the 120th ASEE Annual Conference and Exposition, Atlanta, USA, 23-26 June 2013, P6879.

  • DYR Chong, “Biomechanics in Orthopaedic and Sports Applications”, Proceedings 2011 International Conference of Korean Society of Sport Biomechanics, 25-26 November 2011. (invited speaker)

  • DYR Chong, UN Hansen, SJ Yeo, SY Poh, SWY Cai, NN Lo, AA Amis, “Bone Remodelling Predictions in the Proximal Tibia after Implantation of the MIS Mini-Keel Tibial Prostheses”, 55th Annual Meeting of the Orthopaedic Research Society, Nevada, USA, 22-25th February 2009.

  • DYR Chong, AA Amis, UN Hansen, “Is Fixation Performance of MIS Mini-keel Tibial Prosthesis Mechanically Comparable to Standard Stemmed Prosthesis? A Finite Element Modelling Study”, 54th Annual Meeting of the Orthopaedic Research Society, San Francisco, USA, 2-5th March 2008.

  • D.Y.R. Chong, F.X. Che, L.H. Xu, H.J. Toh, J.H.L. Pang, B.S. Xiong, B.K. Lim, “Performance Assessment on Board-level Drop Reliability for Chip Scale Packages (Fine-pitch BGA)”, 56th Electronic Components & Technology Conference, California, USA, 30th May to 2nd June, 2006.

  • D.Y.R. Chong, K. Ng, J.Y.N. Tan, P.T.H. Low, J.H.L. Pang, F.X. Che, B.S. Xiong, L.H. Xu, “Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages”, 55th Electronic Components & Technology Conference, Florida, USA, 31st May to 3rd June, 2005.

  • S.J. Pan, D.Y.R. Chong, A.Y.S. Sun, “Heat Spreader Impact on Electrical Performance of a 4-Layer PBGA Package”, 54th Electronic Components & Technology Conference, Nevada, USA, 1st to 4th June, 2004.

  • D.Y.R. Chong, K. Ng, J.Y.N. Tan, P.T.H. Low, J.H.L. Pang, F.X. Che, “Drop Test Reliability Assessment of Leaded & Lead-Free Solder Joints for IC Packages”, 6th Electronics Packaging Technology Conference, Singapore, 8-10th Dec, 2004.

  • D.Y.R. Chong, W.E. Lee, J.H.L. Pang, T.H. Low, B.K. Lim, “Mechanical Characterization in Failure Strength of Silicon Dice”, Inter Society Conference on Thermal Phenomena (ITherm 2004), Las Vegas, USA, 1st to 4th June, 2004.

  • D.Y.R. Chong, B.K. Lim, Kenneth J. Rebibis, S.J. Pan, Krishnamoorthi S., R. Kapoor, Anthony Y.S. Sun, H.B. Tan, “Development of a New Improved High Performance Flip Chip BGA Package”, 54th Electronic Components & Technology Conference, Nevada, USA, 1st to 4th June, 2004.

  • D.Y.R. Chong, C.K. Wang, K.C. Fong, “Finite Element Parametric Analysis on Fine-Pitch BGA (FBGA) Packages”, Proceedings of ASME International InterPack’03 Conference, Hawaii, USA, 6th to 11th July, 2003.

  • D.Y.R. Chong, R. Kapoor, Y.S. Sun, “Reliability Assessment of a High Performance Flip-Chip BGA Package (organic substrate based) using Finite Element Analysis”, 53rd Electronic Components & Technology Conference, Louisiana, USA, 27th to 30th May, 2003.

  • D.Y.R. Chong, K.Y. Goh, R. Kapoor, A.Y.S. Sun, “Reliability Analyses for New Improved High Performance Flip Chip BGA Packages”, 5th Electronics Packaging Technology Conference, Singapore, 10-12th Dec, 2003.